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IPC/JEDEC J-STD-033 Bake Conditions烘烤条件

时间:2014-04-14 16:28:10 来源:鼎华科技 点击: 3756次

Different packages have different levels of moisture sensitivity. The higher the amount of moisture inside a package, the higher the thermomechanical stresses inside the package during board mounting will be.  These stresses are brought about by the rapid vaporization of the trapped moisture, and can be large enough to fracture the package during board mounting.  Package cracking under such circumstances is known as 'popcorn cracking.' IPC/JEDEC J-STD-020 defines the Moisture Sensitivity Levels (MSL) of surface mount devices.

不同的包装袋对潮湿度有不同的敏感度,若包装袋内湿度过高,在贴装时若受到较大的热能,压力,这些外来的影响都会损坏,因为它们都会快速的吸附空气中的湿气。危害大到可以破坏外部包装。若遇到外包破裂这样的情况,大家知道是会发生爆炸的。本产品的详细列举了的湿气敏感度级别。

Moisture-sensitive devices are baked and vacuum-sealed inside a moisture barrier bag prior to shipment in order to minimize their tendency to exhibit popcorn cracking during board mounting.  Users of such devices are likewise required to board mount the units within a prescribed period after the bag has been opened. Failure to do so calls for a rebake of the units prior to board mounting.

怕潮湿又敏感的元器件都要烘烤后才能使用,在出货前放干燥剂密封存贮在真空的包装袋中,这样在贴装时就将破损机会降低到最小了。使用这样的元器件在打开包装前照样需要有内部的相关规定。若未按此操作则要重新烘烤待装贴的元器件。

                   

Table 1 shows the bake conditions recommended by IPC/JEDEC J-STD-033 at the user's site if the out-of-bag time prescribed has expired prior to board mounting. Table 2 shows the bake conditions required by IPC/JEDEC J-STD-033 at the manufacturer's site, prior to dry-packing the parts.

下表一列举了本品从包装袋内拿出后的参考烘烤时间的规定。

下表二列举了本品在生产过程有干燥剂情况下烘烤所需的条件。

Table 1. IPC/JEDEC J-STD-033 Bake Conditions for Drying SMD's at the User Site.

 

Pkg Thickness元件厚度

MSL

Bake @ 125C

Bake @ 90C/<=5%RH

Bake @ 40C/<=5%RH

Saturated @ 30C/85%

@ Floor Life Limit + 72H @ 30C/60%

Saturated @ 30C/85%

@ Floor Life Limit + 72H @ 30C/60%

Saturated @ 30C/85%

@ Floor Life Limit + 72 H @ 30C/60%

<= 1.4 mm

2a

5 H

3 H

17 H

11 H

8 D

5 D

3

9 H

7 H

33 H

23 H

13 D

9 D

4

11 H

7 H

37 H

23 H

15 D

9 D

5

12 H

7 H

41 H

24 H

17 D

10 D

5a

16 H

10 H

54 H

24 H

22 D

10 D

<= 2.0 mm

2a

21 H

16 H

3 D

2 D

29 D

22 D

3

27 H

17 H

4 D

2 D

37 D

23 D

4

34 H

20 H

5 D

3 D

47 D

28 D

5

40 H

25 H

6 D

4 D

57 D

35 D

5a

48 H

40 H

8 D

6 D

79 D

56 D

<=4.5 mm

2a

48 H

48 H

10 D

7 D

79 D

67 D

3

48 H

48 H

10 D

8 D

79 D

67 D

4

48 H

48 H

10 D

10 D

79 D

67 D

5

48 H

48 H

10 D

10 D

79 D

67 D

5a

48 H

48 H

10 D

10 D

79 D

67 D

                          

Table 2. IPC/JEDEC J-STD-033 Bake Conditions Prior to Dry Packing SMD's at the Manufacturer's Site.

 

Pkg Thickness元件厚度

MSL

Bake @ 125C

Bake @ 150C

<= 1.4 mm

2a

3

4

5

5a

8 Hours

16 Hours

21 Hours

24 Hours

28 Hours

4 Hours

8 Hours

10 Hours

12 Hours

14 Hours

<= 2.0 mm

2a

3

4

5

5a

23 Hours

43 Hours

48 Hours

48 Hours

48 Hours

11 Hours

21 Hours

24 Hours

24 Hours

24 Hours

<= 4.5 mm

2a

3

4

5

5a

48 Hours

48 Hours

48 Hours

48 Hours

48 Hours

24 Hours

24 Hours

24 Hours

24 Hours

24 Hours

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